PROCESS DESCRIPTION

The production of electronic assemblies is carried out using a variety of soldering methods. In most cases, electronic assemblies (printed circuit boards) are manufactured using reflow and wave or selective soldering machines.

The continuing trend towards further miniaturization of components and printed circuit boards, the use of new generations of active components (BGA, CSP, COD, DCP) and the introduction of lead-free solder materials are leading to an increasing demand for high-quality solder joints and reproducible processes.

This increases the demands on these soldering processes.

At the same time, however, the focus is on saving consumables and the energy needed to produce them.